With more devices relying on wireless connections, there is a greater need to ensure that suitable high-performance wireless connectivity modules are used. Murata Electronics meets this need with the Type 1LV Module. This module is based on the Cypress CYW43012 combo chipset, enabling it to implement highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms. This ensures that WLAN and Bluetooth collaboration is optimized for maximum performance of up to 72.2Mbps PHY data rate on WiFi and 3Mbps PHY data rate on Bluetooth.
The Type 1LV Module’s embedded IPv6 network stack for use with WICED SDK and TCP keepalive is handled internally, so that the host processor can keep sleeping. This enables ultra-low power consumption in power-sensitive applications. It is also packaged in a shielded ultra-small form factor with dual-band WiFi and Bluetooth capabilities, making it perfect for integration into size-sensitive applications such as IoT applications, handheld wireless systems, gateways and more.

Features
- Supports WiFi 802.11a/b/g/n up to 72.2Mbps PHY data rate
- Supports Bluetooth 5.0 BR/EDR/LE up to 3Mbps PHY data rate
- Communicates using the AP and STA dual-mode network topology
- Chipset is Cypress CYW43012
- Functions in DSSS, CCK and OFDM modulations
- WLAN supports the SDIO v2.0 SDR25 interface
- Bluetooth section supports high-speed 4-wire UART interface
- NXP i.MX Linux and FreeRTOS, Cypress WICED
- FCC/iC “reference” certified
Target applications
- Smart home
- Industrial IoT
- Sensor network
- Enterprise-class intelligent control
- Data systems
- IoT gateway
- Medical systems (non-implantable)
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